Difficult immersion gold double-sided electronic OEM customized product 4G 5G smart phone blind hole HDI board

Supplier: Jinhua Technology (Shenzhen) Co., Ltd.
Region: Guangdong, China
Contact: Ms Rosia Cao
Price: $3.50 / 1 - 999 pieces
$1.50 / 1000 - 4999 pieces
$0.50 / 5000 - 9999 pieces
$0.10 / >=10000 pieces
Min. Order: 1 piece

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Product details

Key words:	Immersion Gold High Density PCB	product name:	High Density PCB
application:	electronic product	payment terms:	L/C, Western Union, D/P, D/A, T/T, MoneyGram
Surface treatment:	Electroless Nickel Gold	Certificate:	ISO9001/ISO14001/CE/ROHS
Packaging Details:	Bubble packaging, pearl cotton packaging, anti-static bags, vacuum bags	Substrate:	FR4,FR4
minute. Line spacing:	3 million	minute. line width:	3 million
minute. Hole size:	0.15 mm	brand:	Jinhua
Copper thickness:	1 oz	model:	JH-HDI-033
Package preview:		Supply capacity:	60000 pieces per month
port:	Shenzhen	type:	HD PCB
Origin:	Guangdong, China	Plate thickness:	Can be customized, 1.6mm
MOQ:	1	Serve:	Multi-layer immersion gold high-density PCB service
Test service:	100% AOI testing	layer:	1~20 floors
Board size:	300*600mm, or can be customized

HDI stands for High Density Interconnect PCB. Due to their increased density, they provide an essential routing solution for the large pin-count chips used in mobile devices and other high-tech products.

What type of HDI boards can you get from us?

Due to design constraints, HDI PCBs have much higher routing and pad connection densities than conventional PCBs. The structure construction is explained below.

1+N+1– The PCB contains 1 High Density Interconnect layer "build".

i+N+i (i≥2)– The PCB contains 2 or more "build-up" high-density interconnect layers. Microwells on different layers can be staggered or stacked.

Any layer HDI– The layers of the PCB are high-density interconnect layers that allow conductors on any layer of the PCB to freely interconnect with copper-filled stacked microvia structures.

Applications of HDI PCBs:

·Automobile industry:Engine control unit, GPS, dashboard electronics.

·Telecommunications Industry:Computers, Laptops, Tablets, Wearable Electronics, IoT

·army:Military routers, COTS boards, etc.

· medical:35 micron microspace plate, pacemaker

· Semiconductor:MCM/Flip Chip/Wire Bond, Stacked Micro Via

HDI production process:

Product Description

HDI PCB process capability
project	content	production capacity
1	layers	Standard 4-22 layers, advanced 30 layers
2	Material	FR4 Standard, FR4 High Performance, Halogen Free FR4, Rogers
3	Copper products	18um-70um
4	Minimum tracks and clearances	0.075mm/0.075mm
5	PCB thickness	0.4mm-6.0mm
6	biggest size	610mm*450mm, depends on the laser drilling machine
7	surface treatment	OSP, ENIG, immersion tin, immersion silver, electrolytic gold, gold finger
8	minute. mechanical drill	0.15 mm
9	minute. laser drilling	Standard 0.1mm, Advanced 0.075mm
10	Quality Standard	IPC-600, 6012, Class II & III
11	HDI	4+N+4, 4-step arbitrary layer connection