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Perfect Semiconductor Wafer Laser Marking Machine with Laser-20W
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Supplier: Perfect Laser (Wuhan) Co., Ltd. -
Region: Hubei, China -
Contact: Ms Lydia Yuan -
Price: $8200.00 / 1 - 4 units
$7500.00 / >=5 units -
Min. Order: 1 unit
Product details
| Place of origin: | hubei china | Weight (kg): | 200kg |
| payment terms: | L/C, Western Union, T/T, MoneyGram | Health status: | new |
| Showroom location: | not any | Main selling points: | Easy to operate |
| application: | Laser scribing | Workbench width: | 200*200mm |
| Warranty: | 1 year | Supply capacity: | Annual production of 2,000 units of Perfect Laser-20W semiconductor wafer dicing laser marking machine |
| Temperature control accuracy: | 0.5℃ | Core components: | laser |
| Package preview: | port: | Shanghai Shenzhen Wuhan | |
| Guide rail brand: | Silver | Whether CNC: | Yes |
| Core component warranty: | 3 years | Mechanical test report: | if |
| Marking speed: | 240mm/sec | product name: | 20W semiconductor wafer cutting laser marking machine |
| brand: | perfect laser | Marking accuracy: | ±10 micron |
| Applicable industries: | other | Packaging details: | Thick wooden box that meets the international export standards of laser dicing machine PE-20W |
| Laser power: | 20W | Laser type: | fiber-optic laser |
| Laser source brand: | Raycus | Applicable materials: | Silicon metal |
| Working power supply: | 220V/50Hz/1.5KVA | cooling method: | water cooling |
| Supported graphic formats: | AI, PLT, DXF, BMP, Dst, Dwg, LAS, DXP | Video outbound inspection: | if |
| Laser wavelength: | 1064nm | Marketing type: | 2020 new products |
product description
Perfect Laser-20W semiconductor wafer dicing laser marking machine
Model: PE-20W/50W
Contact: Nina Skype: perfectlaser027 Email: sales27@perfectlaser dot net
introduce.
this20W semiconductor wafer cutting laser marking machineWidely used in the solar photovoltaic industry, dicing processing (cutting part) of monocrystalline silicon and polycrystalline silicon solar cells (cells) and silicon wafers (silicon wafers)
Samples and Applications
describe.
20W semiconductor wafer cutting laser marking machineThe direct plug-in optical path design has higher processing accuracy and the wafer laser dicing machine can achieve better results. Renovation of the servo motor of the laser dicing solar cell machine: smoother operation, lower cutting noise, and more user-friendly design; Autonomous plane dust removal device: the processing effect of the solar cell dicing machine is better. The laser signal control part has been improved, and the software runs more stable and faster.
detailed picture
Technical data
Model specifications | PE-20W/50W laser dicing machine | ||
Laser wavelength | 1064nm | ||
Laser power | 20W | ||
Line width | 50 micron | ||
Marking speed | 240mm/sec | ||
Marking accuracy | ±10 microns | ||
Workbench width | 200×200mm | ||
Temperature control accuracy | 0.5℃ | ||
Working power supply | 220V/50Hz/1.5KVA | ||
workbench | Automatic cell adsorption and dust removal | ||
cooling method | High-precision constant temperature circulating water cooling professional integration | air cooling | |
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