High Quality 9W High Voltage SMD 2835 AC220V LED Printing Round Paint LED Aluminum PCB for Tube Light Products from Pengjiang District Zhuoxing Hardware Factory

Product Details

port:	Shenzhen/Guangzhou	Minute line width:	0.3-0.35um
Plate thickness:	0.7-1.6 mm	application:	Electronic equipment
product name:	circuit board	place of origin; place of origin:	Guangdong, China
Serve:	Provide OEM service	payment terms:	L/C, Western Union, D/P, D/A, T/T, MoneyGram
Minute line spacing:	0.3-0.35um	Types of:	Electronic board
usage:	Foundry Electronics	model:	HM-LV10189
Copper thickness:	15-35 microns	Packaging Details:	Carton
Minute Hole Size:	0.3-5mm	Certificate:	CUL/ROHS/ISO9001
Package preview:		Substrate:	aluminum material
Supply capacity:	50000000 pieces per month	thing:	custom circuit board
Name:	Projector aluminum substrate	Surface treatment:	HASL/ENIG/OSP/Immersion Silver
Solder Mask:	green. blue.	Material:	aluminum material

High Quality 9W High Voltage SMD 2835 AC220V LED Round Ink Printing Aluminum LED PCB For Tube Light

Product Description

PCB capacity
Substrate	FR-4, 22F, CEM-3, CEM-1, Aluminum, HB, 94V0
layers	1-22 floors
largest panel	1550mm*800mm
copper thickness	0.5oz, 1oz, 2oz, 3oz, 4oz
Dielectric thickness	0.05mm, 0.075mm, 0.1mm, 0.15mm, 0.2mm
Core thickness	0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm, 3.2mm
plate thickness	0.4mm - 4.0mm
Thickness Tolerance	+/-10%
aluminum processing	Drilling, Tapping, Milling, Milling, Die, Break off tabs available
smallest hole	0.2 mm
working voltage	2.5kVDC (0.075mm dielectric), 3.75kVDC (0.15mm dielectric)
Minimum track width	0.2 mm (8 million)
Minimum Track Clearance	0.2 mm (8 million)
Minimum SMD pad pitch	0.2 mm (8 million)
surface treatment	HASL lead-free, immersion gold, immersion silver
Solder mask color	green, blue, etc.
legend color	black, white, etc.
electronic quiz	yes
Certificate	UL/CUL/ROHS/ISO9001

PCB assembly capability
Minimum IC pitch	0.2mm
Minimum Die Size	0201(0.2x0.1)/0603(0.6x0.3mm)
Maximum BGA size	74x74mm
BGA pitch	1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter	0.40mm (minimum), 1.00mm (maximum)
QFP Lead Spacing	0.38mm (minimum), 2.54mm (maximum)
volume	One piece to small batch production Low-Cost First Article Construction arrange delivery
Assembled	Surface Mount (SMT) Assembly DIP assembly Hybrid (Surface Mount and Through Hole) Technology Single or double sided placement cable assembly
Parts procurement	Turnkey (we provide parts) Shipping (you provide the parts) You supply some parts, we do the rest
Solder type	Leaded Lead-free/ROHS Compliant
other abilities	Repair/Rework Services mechanical assembly boxed Mold and Plastic Injection

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