| Surface Finishing: | Immersion Tin / Immersion Ni / Au / Plated Ni/Au; | Line Width Control Tolerance: | ≤4milLine:±0.015mm (±0.0006")>4milLine:±10%; |
| Layer to Layer Registration: | ±0.038mm(±0.0015"); | Copper Thickness: | 17um-35um; |
| Number of Layers: | 2 Layers - 36 Layers+; | Min. Hole Size: | 0.15mm; |
| Supply Ability: | 300000 Piece/Pieces per Month High Quality; | Min.BGA Pad Pitch: | 0.30mm(0.0118"); |
| Brand Name: | Fumax; | Min. Line Spacing: | 0.075mm; |
| Board Thickness: | 0.4mm-4.5mm; | Place of Origin: | Guangdong China; |
| Impedance Control Tolerance: | ±8%; | Port: | Shenzhen / HK; |
| Model Number: | FMP200113-001; | Solder Mask Registration: | ±0.02mm(±0.0008"); |
| HDI Structure: | ELIC(2-8step); | Payment Terms: | T/T,Western Union,Paypal; |
| Min.SMT/QFP Pad Pitch: | 0.250mm(0.0100"); | Min.Line Width: | 0.035mm(0.0014"); |
| Packaging Detail: | Customized Packaging; | Base Material: | FR-4 , Others on Request; |
| Max.Board/Array Size (Universal ET): | 2L:2000mm*500mm (78.7402"*19.6850")≥4L:1150mm*430mm (45.2755"*16.93"); | Min.Solder Mask Dam: | 0.05mm(0.0020"); |
| Min. Line Width: | 0.075mm; | | |