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Hot sale OEM PCB factory 1oz,2oz,3oz,4oz,5oz,6oz rigid/flex thick copper PCB

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Product details
port:Shenzhen/GuangzhouPlate thickness:0.4/0.6/0.8//1.0/1.2/1./1.6/2.0mm,0.1-0.5mm
legend:white, black, red, yellowSupply capacity:150,000 square meters per year
PCB standard:IPC-A-600Surface treatment:Immersion Gold, HASL, OSP, ENEPIG, Flash Gold
Sample delivery:within 24 hoursProduct quotation:within 2 hours
Substrate:Shengyi, DuPont, PIOrigin:Guangdong, China
payment terms:L/C, Western Union, D/P, D/A, T/T, MoneyGram, Alipayminute. Line spacing:3 million
model:flexible boardServe:24 hours technical service
type:Thick copper PCBBoard size:Custom thick copper PCB
Package preview:minute. Hole size:0.1-6.5mm
Key words:Thick copper PCBminute. line width:3 million
Packaging Details:Thick copper PCB: PCB: vacuum package, carton PCBA: ESD package, cartonSolder Mask:Green Soldermask/Black PI/Yellow PI
Maximum number of layers:8 litersbrand:Dingfeng Electronics Co., Ltd.
Copper thickness:0.5-2 oz
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Hot sale OEM PCB factory 1oz,2oz,3oz,4oz,5oz,6oz rigid/flex thick copper PCB

 

 

product information

 

thing boring flexible Rigid-flex
Maximum number of layers 60 liters 8 liters 36 liters
Inner layer minimum trace/space 3/3 million 3/3 million 3/3 million
Minimum trace/space on outer layers 3/3 million 3.5/4 million 3.5/4 million
Inner Layer Maximum Copper 6 oz 2 oz 6 oz
The maximum amount of copper in the outer layer 6 oz 2 oz 3 oz
Minimal Mechanical Drilling 0.15 mm 0.1mm 0.15 mm
Minimal Laser Drilling 0.1 mm 0.1mm Item RIGIDFLEX Rigid-Flexible 0.1 mm
Aspect Ratio (Mechanical Drilling) 20:1 10:1 12:1
Aspect Ratio (Laser Drilled) 1:1 / 1:1
Press fit hole tolerance ±0.05mm ±0.05mm ±0.05mm
Bypass tolerance ±0.075mm ±0.075mm ±0.075mm
NPTH tolerance ±0.05mm ±0.05mm ±0.05mm
Countersink Tolerance ±0.15mm ±0.15mm ±0.15 mm
plate thickness 0.4-8 mm 0.1-0.5 mm 0.4-3 mm
Plate thickness tolerance (<1.0mm) ±0.1 mm ±0.05mm ±0.1mm
Plate thickness tolerance (≥1.0mm) ±10% / ±10%
Impedance tolerance Single-ended: ±5Ω (≤50Ω), ±7% (>50Ω) Single-ended: ±5Ω (≤50Ω), ±10% (>50Ω) Single-ended: ±5Ω (≤50Ω), ±10% (>50Ω)
Differential: ±5Ω (≤50Ω), ±7% (>50Ω) Differential: ±5Ω (≤50Ω), ±10% (>50Ω) Differential: ±5Ω (≤50Ω), ±10% (>50Ω)
Minimum board size 10*10mm 5*10mm 10*10mm
board size 22.5*30 inches 9*14 inch 22.5*30 inches
Profile Tolerance ±0.1 mm ±0.05mm ±0.1 mm
Minimum BGA 7 million 7 million 7 million
Minimal Surface Mount Technology 7*10 million 7*10 million 7*10 million
surface treatment Immersion Gold, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating Immersion Gold, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating Immersion Gold, Gold Finger, Immersion Silver, Immersion Tin, HASL(LF), OSP, ENEPIG, Flash Gold; Hard Gold Plating
Solder mask Green, Black, Blue, Red, Matte Green Green Soldermask/Black PI/Yellow PI Green, Black, Blue, Red, Matte Green
Minimum Solder Mask Clearance 1.5 million 3 million 1.5 million
Minimum Solder Dam 3 million 8 million 3 million
legend white, black, red, yellow white, black, red, yellow white, black, red, yellow
Minimum legend width/height 4/23 million 4/23 million 4/23 million
Strain Fillet Width / 1.5±0.5mm 1.5±0.5mm
bow and twist 0.30% / 0.05%



 

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