Black porcelain aluminum nitride ceramic substrate High thermal conductivity Strong bonding force High insulation

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Product Details
Origin:China (Mainland) GuangdongMinute line width:0.05mm
Plate thickness:0.127mm-3mmbrand:Combat
Minute Hole Size:0.06mmBoard Dimensions:other
type:Ceramic circuit boardMinute line spacing:0.05mm
Copper thickness:0.5μm-5mmSubstrate:aluminum nitride
Surface treatment:HASL, immersion goldmodel:3741
payment terms:L/C, Western Union, D/P, D/A, T/T, MoneyGram
Product parameters

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Product parameters
Material Aluminum oxide, aluminum nitride, silicon nitride and other ceramic materials, silicon carbide, sapphire, glass and other transparent wafer materials
plate thickness 0.127mm-3mm, support customization
layers Single layer, single sided, single double sided
copper thickness 0.5μm-5mm
surface metal layer Titanium, copper, nickel, silver, gold, palladium, tin, platinum, tungsten, etc.
Product Description

 

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