Products

DPC ceramic substrate, DBC copper clad ceramic substrate, AMB ceramic substrate, Ceramic substrate metallization, Ceramic circuit board

Contacts

  • Region: China
  • Address: 2/f, Building A, Henghui Electronics Co., Ltd., Xiyang Town Industrial Park, Meizhou, Guangdong, China
  • Contact: Mr
  • Phone:
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Company Description

Meizhou Zhanzhi Electronic Technology Co., Ltd. (Zhanzhi Technology) was established in 2017. The company is located in Henghui Industrial Park, Dongsheng Industrial Zone, Meijiang District, Meizhou City. It is a company that has been focusing on the research and development, production and application of semiconductor ceramic substrates for many years. national high-tech enterprise. Since its establishment, the company has been adhering to the tenet of "quality as the root, service as the foundation", creating product quality with international standards, and creating high-stability and ultra-low energy consumption products with the advantages of high technology and high output. The company has original experience in DPC process ceramic substrates, and has a leading technology level in the ceramic substrate packaging device manufacturing industry and enjoys a high reputation. Zhanzhi Technology is committed to becoming the world's top semiconductor ceramic substrate supplier. The whole company unites as one, constantly innovates and develops new products, and now has 7 utility model patents and 15 invention patents. The company has successively obtained ISO 9001:2015 quality assurance system certification and IATF 16949:2016 automotive quality management system certification in 2018, and obtained the national high-tech enterprise certification at the end of 2020. The alumina, aluminum nitride, silicon nitride, zirconia, silicon carbide, beryllium oxide, sapphire, ZTA toughened ceramic substrates, single crystal silicon wafers, ferrites, glass wafers, etc. produced by Zhanzhi Technology have been exported to Europe and the United States, Japan, South Korea, Taiwan and other countries and regions, and are widely used in semiconductor packaging, artificial intelligence, automotive electronics, face recognition, UVC sterilization components (new coronavirus), UVA curing, 5G products, IGBTs, medical equipment, high-power power supplies, sensors , lasers, ultrasonic detectors, solar cells, aerospace and military products and other fields. We will continue to provide products and services that exceed customer expectations, and work hand in hand with customers to achieve win-win cooperation and create brilliance together!

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