MECHANIC Solder Paste XGSP30 Sn63/Pb37 Medium Temperature Glue Flux Mobile Phone PCB Repair
- 0.01 set
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Product Details
| payment terms: | D/A, T/T, Western Union, MoneyGram | BGA solder balls: | usable |
| brand: | mechanical | Supply capacity: | 100 sets per month |
| Origin: | Guangdong, China | Packaging Details: | carton |
| Function: | suitable for welding | product name: | Flux paste |
| port: | Shenzhen, Guangzhou, Yiwu | delivery time: | stock available |
| BGA reballing tool: | usable | price: | Negotiable |
| Model: | Mechanical XGSP30 | MOQ: | 1 bottle |
| weight: | 100G/bottle | application: | For BGA reballing |
Product Description
MECHANIC solder Paste XGSP30 Sn63/Pb37 solder Paste Flux Medium Temperature Solder Paste Mobile phone PCB repair
| Model | Mechanical Solder Paste |
| Material |
tin-lead alloy
|
| melting point |
183 degrees Celsius
|
|
certified
|
RoHS Compliant
|
|
wettability
|
Bright and uniform solder joints
|
|
Printability
|
Eliminate pits and knots missed during printing
|
|
feature
|
Reflow soldering does not produce solder balls and solder bridges
|
|
service life
|
It can be printed continuously for more than ten hours at room temperature without producing tin beads
|
|
application
|
Radiator module welding & LED welding & high frequency welding
|
| gross weight |
About 16.0-60.0g/pc
|
our service
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