Hot sale SMT solder paste Sn63Pb37 high performance solder paste

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Product details

Material:	Alloy Powder and Flux	Powder size:	T2.5-T6
payment terms:	L/C, Western Union, T/T, Alipay	place of origin; place of origin:	Guangdong, China
alloy composition:	tin-lead alloy	Package preview:
brand:	Huake	Model:	Sn63Pb37
Warranty:	**	weight:	500g/can
Customization support:	OEM,ODM,OBM	port:	Shenzhen Port
Operating temperature:	183°C	sample:	usable

SMT solder paste

Product Type: SMT Solder Paste

Huake Industrial Solder Paste is a no-clean solder paste developed and produced in accordance with IPC, JIS and other international standards. It is made of new rosin resin and compound anti-oxidation technology, spherical solder alloy powder with low oxidation degree and paste environment-friendly flux with strong chemical stability. It is suitable for all kinds of precision welding in SMT production of electronic assembly process.

Huake Industrial has a complete range of solder paste, many alloy models, and a wide range of alloy melting points (138°C~287°C), which can meet the selection and application of various industries and products. Huake Industrial solder paste is divided into mobile phone solder paste, chip semiconductor packaging solder paste, LED solder paste, low-temperature solder paste for heat dissipation modules, etc.

Features:

1. Good printing roll printing and missing printing performance, fine printing can also be completed on pads with glue

The spacing is as small as 0.4mm;

2. The continuous printing time is long, and it will not collapse after printing for several hours, and the viscosity is good

The change is small, and the patch components are not easy to shift;

3. It has excellent welding performance and can complete good wetting in different parts;

4. Good soldering performance can still be achieved in a wide reflow temperature range;

5. Less residue after welding, transparent appearance, high insulation resistance,

The PCB will not be corroded and can meet the requirements of no-cleaning;

6. It has better ICT test performance and will not cause misjudgment;

7. It is suitable for soldering of special gold-plated PCB materials, and has no irritating smell.

Lead solder paste:

alloy composition	melt point (°C)	feature	Application field
Sn63Pb37	183	Good welding activity and weldability Good reliability, good wettability, long time printing is not easy to dry, low residue, high impedance.	Suitable for LED chips, communications, IT, security and other electronic products. It is widely used and reliable and low cost.
Sn55Pb45	183-203	Good soldering activity and reliability, good wettability and low cost of use.	Suitable for LED chips, communications, IT, security and other electronic products.
Sn43Bi14Pb43	144-163	Low temperature, good solderability Activity and reliability, low application cost.	It is suitable for electronic products such as low-cost radiators, heat-sensitive components, and LED chips.
Sn62.8Pb36.8Ag0.4	178-182	Excellent welding activity and Reliable welding, good wettability, Excellent secondary scalability.	Suitable for high-quality LED chips, communications, IT, security and other electronic products.
Sn62Pb36Ag2.0	179	Excellent welding activity and Reliable welding, good wettability, Excellent secondary scalability.	Suitable for high-quality LED chips, communications, IT, security and other electronic products.
Sn5Pb92.5Ag2.5	287-296	Dedicated to power semiconductor package welding, stable chemical properties, can meet long-term use requirements Dispensing and printing.	Special for semiconductors, in line with EU high lead exemption standards.

Other alloy grades can be produced according to customer requirements.

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