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MECHANIC original solder paste 183C melting point solder paste Sn63/Pb37

Product details
application:For BGA Re-Ball Reworkweight:100G/bottle
BGA ball return tool:usableBGA solder balls:usable
Supply capacity:100 sets per monthMinimum order quantity:1 bottle
payment terms:D/A,T/T,Western Union,MoneyGramFunction:Suitable for soldering
delivery time:stock availablebrand:mechanical
place of origin; place of origin:Guangdong, Chinaport:Shenzhen, Guangzhou, Yiwu
Model:mechanicalPackaging Details:carton
product name:Flux Pasteprice:Negotiable

Product Description

MECHANIC original solder paste 183C melting point solder paste Sn63/Pb37

 

Model Mechanical Solder Paste
Material
Tin-lead alloy
melting point
183 degrees Celsius
Certification
RoHS Compliant
wettability
Bright and uniform solder joints
printability
Eliminate missing pits and knots during printing
feature
Reflow soldering does not produce solder balls and solder bridges
service life
Can print continuously for more than ten hours at room temperature without tin beading
application
Radiator Module Welding & LED Welding & High Frequency Welding
gross weight
About 16.0-60.0g/pcs
 
 
 
 
our service

 

 

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