Products
lapping machine, lapping & polishing polisher, Double Sided Lapping Machines, Single Sided Lapping Machines, wafer grinding machines
Contacts
- Region: China
- Address: Zone B, Yuanshan Industrial Zone, Shangcun Community, Gongming St., Shenzhen, Guangdong, China
- Contact: Mr lua
- Phone:
- Mobile:
Company Description
Shenzhen Tengyu Grinding Technology Co., Ltd. was located in Guangming New District, Shenzhen,China, with a registered capital of 5 million yuan. The company's plant area is about 13,000 square meters. It is an enterprise engaged in surface grinding and polishing technology. The company specializes in R&D, production and sales of various high-precision flat grinding equipment, flat polishing equipment, high-speed thinning equipment, 3D polishing equipment and its supporting consumables. Its products are widely used in precision processing of mechanical seals, electronic communications, ceramics, semiconductors, optical crystals, aerospace, automotive mold, LED, mobile phone accessories, hardware and other components. The customer base is spread all over the country and abroad, and its representatives include TF, MEEYA, Tongda Group, Hanslaser, and many other well-known companies.The company has a high-quality R&D and management team, and the company's products have strong technical update capabilities and market competitiveness. At present, many products have filled the gaps in China's grinding and polishing industry and have reached the international advanced level. Our company has obtained 28 utility model patents in equipment and technology, and has been rated as a national high-tech enterprise. We take quality as life, time as credibility, and innovation as the business philosophy of competitiveness. We continue to absorb new ideas, strictly control quality, provide comprehensive tracking services, insist on making high-quality products, and be the leader of the industry.The main materials used are: grinding and polishing of ceramics, silicon carbide, silicon wafers, sapphire, optical glass, cemented carbide, stainless steel, tungsten steel, aluminum, copper, diamond and other materials.At present, the mass production of wafer thinning machine, wafer polishing machine, plane grinder, double-sided grinder, sapphire grinder and other equipment, diamond polishing liquid, silicon carbide polishing liquid, alumina polishing liquid, silicon dioxide polishing liquid, copper Discs, iron discs, CBN grinding wheels, various polishing pads, etc. At the same time, our company can also customize various equipment according to customer needs.
