SMT EMI Gasket
- 0.01 1 - 1 pieces
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Product Details
SMT Gasket is designed for PCB grounding using Surface Mount Technology (SMT), functioning as an SMD grounding terminal to minimize EMI noise and improve electrical stability in electronic enclosures. It offers excellent conductivity, high durability, thermal resistance, and consistent grounding performance.
Product Structure
Explore Solutions
You can browse the product catalog available here or contact our engineers through our customer service department to customize SMT foam gaskets to your specific cross-sectional shape, cut to length, or unique die-cut shapes.
Extruded Silicone Type:
The conductive SMT Gasket features an extruded silicone core wrapped with a conductive layer such as conductive PI film or metal foil. It represents the earliest and most widely adopted SMT gasket design, offering reliable conductivity and stable compression performance.
Open-Cell Silicone Foam Type:
The SMT foam Gasket utilizes a modified open-cell silicone foam core enclosed by a conductive layer. This structure provides excellent compression adaptability and low contact pressure, making it suitable for high-deformation, low-stress applications.
Closed-cell Silicone Foam Type:
The PCB SMT Gasket is constructed with a closed-cell silicone foam core coated with a conductive layer, typically conductive PI film or metal foil. It is ideal for general EMI shielding requirements and is commonly attached using adhesive without soldering.
Extruded Silicone Foam Type:
This EMI SMT Gasket combines an extruded silicone foam with a conductive outer layer, designed to prevent side buckling after compression. It is mainly applied in folded or angled configurations requiring high dimensional stability and resilience.
Partial PI-Wrapped Ultra-Thin Type:
The conductive SMT gasket adopts an ultra-thin, miniaturized profile with conductive PI film applied only on the soldering surface. It enables reliable SMT grounding with minimal height and footprint, ideal for high-density and space-constrained PCB designs.
Applications
PCB Ground & EMI Shielding
Product Structure
| Materials | Surface | Conductive PI Film | Gold-Plated | |
| Tin-Plated | ||||
| Core | Silicone Rubber (Hollow type) | |||
| Silicone Foam (Solid Type) | Open-cell | |||
| Closed-cell | ||||
| Standard Size (mm) | Width | Thickness | Length | |
| Max | 12 | 20 | ~ | |
| Min | 1 | 0.3 | 1 | |
Explore Solutions
You can browse the product catalog available here or contact our engineers through our customer service department to customize SMT foam gaskets to your specific cross-sectional shape, cut to length, or unique die-cut shapes.
Extruded Silicone Type:
The conductive SMT Gasket features an extruded silicone core wrapped with a conductive layer such as conductive PI film or metal foil. It represents the earliest and most widely adopted SMT gasket design, offering reliable conductivity and stable compression performance.
Open-Cell Silicone Foam Type:
The SMT foam Gasket utilizes a modified open-cell silicone foam core enclosed by a conductive layer. This structure provides excellent compression adaptability and low contact pressure, making it suitable for high-deformation, low-stress applications.
Closed-cell Silicone Foam Type:
The PCB SMT Gasket is constructed with a closed-cell silicone foam core coated with a conductive layer, typically conductive PI film or metal foil. It is ideal for general EMI shielding requirements and is commonly attached using adhesive without soldering.
Extruded Silicone Foam Type:
This EMI SMT Gasket combines an extruded silicone foam with a conductive outer layer, designed to prevent side buckling after compression. It is mainly applied in folded or angled configurations requiring high dimensional stability and resilience.
Partial PI-Wrapped Ultra-Thin Type:
The conductive SMT gasket adopts an ultra-thin, miniaturized profile with conductive PI film applied only on the soldering surface. It enables reliable SMT grounding with minimal height and footprint, ideal for high-density and space-constrained PCB designs.
| Specification | |||
| Properties | Unit | Typical Value | Remarks |
| Color | / | Silver/Golden | / |
| Size | mm | Customized | OMM |
| Impedance | Ω | ＜0.05 | ESQ-612-02 |
| Salt Spray Test | Ω | ＜0.1 | ASTM B117-03 |
| Reflow Temperature | ℃ | 230~260 | / |
| Compression Rate | % | 25-30 | ESQ-517-27 |
| Aging Test | % | ＞90 | 20% Compression, 70℃ 100H |
| Compression Recovery Rate | % | ＞90 | ESQ-517-26 |
| Solder Adhesion Strength | Kgf | ＞0.5 | GB/T 13936-2014 |
| Operating Temperature | ℃ | -40~150 | / |
| ROHS Requirement | / | Free of halogen and heavy metals | IEC 62321 |
| Flame Retardancy | / | V0 | UL94-2013 |
Applications
PCB Ground & EMI Shielding
- SMT Gasket is used for EMI shielding and grounding by attaching it to the PCB of the LCD module Several pieces of SMT Gasket are used on PCB to maximize EMI shielding and grounding effectiveness. Their positions on PCB are reflected in the PCB circuit design phase.
- Provided in reel typed career packages suitable for SMT
- The touch sensor gasket (touch switch gasket) functions as an electrode connecting the display panel and PCB using the electrostatic touch input method. It is suitable for touch switches of home appliances and industrial devices.
- SMT EMI gasket is installed with automatic surface mounting, while the current spring contact and touch rod method require manual soldering.
- Economic if it replaces an expensive touch grid method.
- Gaskets do not stress PCB/Panel due to their elasticity and have high corrosion resistance.
For Electrical Contacts (Finger Gasket Replacement)
- More cost-effective than gold-plated metal gaskets, offering superior electrical conductivity and reduced initial tooling costs.
- Utilizing a silicone core with excellent resilience, ensuring superior adhesion to mating parts and minimizing contact resistance.
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