Hot Sale Design And Development Electronic Inventor Pcb Assembly
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Product Details
| Model Number: | PCBA manufacturer -0108; | PCB layer: | 1-30 layer; |
| PCB Base Material: | FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium; | PCB Max gold plating thickness: | 50 microinch; |
| Surface Finishing: | HASL; | PCB Aspect Ratio: | 10:1; |
| PCB Surface Finishing: | HASL, EING ,OSP; | PCB Profiling Punching: | Routing, V-CUT, Chamfer; |
| Brand Name: | WELLS; | Selling Units: | Single item; |
| Board Thickness: | 1.6mm; | Single package size: | 19X12X14 cm; |
| Base Material: | FR4; | Packaging Detail: | Inner packing : Bubble bag , Electrostatic bag packaging, Cardboard packing Outer packing : k=k carton packing; |
| Min. Hole Size: | 0.1mm(4mil) for laser holes; | Single gross weight: | 0.3 KG; |
| Copper Thickness: | 1OZ; | Min. Line Spacing: | 3/3mil; |
| PCB Impedance Control: | +/-10%; | PCB Copper Thickness: | 1/3oz ~ 7oz; |
| Min. Line Width: | 3/3mil; | Place of Origin: | Guangdong China; |
| Type: | rigid pcb; | PCB Finished Board Thickness: | 0.2mm ~ 7.0mm(8mil-276mil); |
| PCB Hole Tolerance: | PTH:±0.076mm(+/-3mil), NTPH:±0.05mm(+/-2mil); |
Hot Sale Design And Development Electronic Inventor Pcb Assembly
Product Description
| Items | Rigid PCB Capability | |
| 1 | Layers | 1-30layers |
| 2 | Material | FR-4, High TG FR4 , Halogen-free FR4 , Rogers, Aluminium ,Ceramic(96% Alumina) |
| 3 | Copper Thickness | 1/3OZ-7OZ |
| 4 | Surface Treatments | HASL, HAL, Immersion Gold/Silver/Tin, OSP, Plated Gold, Carbon Ink, etc. |
| 5 | Min. Line/Space | 0.075mm(3mil) |
| 6 | Min. Hole Size | 0.1mm(4mil) for laser drilling, 0.2mm(8mil) for mechanical drilling holes |
| 7 | Max. Board Size | 530mm*620mm(20.9"*24.4") |
| 8 | Hole Tolerance | PTH:+/-0.076mm(+/-3mil), NPTH:+/-0.05mm(+/-2mil) |
| 9 | Soldermask Color | Green, White, Black, Red, Yellow, Blue, etc. |
| 10 | Silkscreen Color | White, Black, Yellow, Blue, etc |
| 11 | Impedance Control | +/-10% |
| 12 | Profiling Punching | Routing, V-Cut, Chamfer |
| 13 | Special Holes | Blind/Buried Holes, Countersunk Holes |
| 14 | Reference Standard | IPC-A-600H Class 2, Class 3 |
| 15 | Certificates | UL, ISO9001, ROHS, SGS |
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| Items | FPC Capability | |
| 1 | Types | Single-Sided, Double-Sided, Multi-Layers(Max. 6Layers), Flex-Rigid PCB |
| 2 | Surface Finishing | HASL, Gold Plating, Electroless nickel immersion Gold, Immersion Tin, OSP |
| 3 | Material | Polyimide(PI), Polyester(PET), FR4 |
| 4 | Copper Foil | ED/RA |
| 5 | Min. Line/Space | 0.05mm(2mil) |
| 6 | Min. Hole Size | 0.2mm(8mil) |
| 7 | Max. Board Size | 400mm*800mm(15.8"*31.5") |
| 8 | Min. Board Thickness | 0.1mm(4mil) |
| 9 | Min. Soldermask Thickness | 10um(0.4mil) |
| 10 | Soldermask Color | Green, Yellow, Black, White, Blue, Red |
| 11 | Profiling | Punching, Routing, V-Cut |
| 12 | Soldering Thermal Resistance | 300 degree/10 seconds |
| 13 | Peeling Strength | >1.4kg/cm |
| 14 | Surface Resistance | 105mΩ |
| 15 | Insulation Resistance | 105mΩ |
| 16 | Dielectric Strength | 9.8*105V/cm |
| 17 | Flammability | UL-94V-0 |
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| Items | PCBA Capability | |
| 1 | Min. IC Pitch | 0.30mm(12mil) |
| 2 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA, U-BGA etc. |
| 3 | Min. Chip Placement | 0105 |
| 4 | Max. PCB Size | 410mm*600mm(16.2"*23.6“) |
| 5 | Min. PCB Thiickness | 0.35mm(13.8mil) |
| 6 | Max. BGA Size | 74mm*74mm(2.9"*2.9") |
| 7 | BGA Ball Pitch | 1mm-3mm(4mil-12mil) |
| 8 | BGA Ball Diameter | 0.4mm-1mm(16mil-40mil) |
| 9 | QFP Lead Pitch | 0.38mm-2.54mm(15mil-100mil) |
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