china factory supply infrared bga chip repair reballing station

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Product details

External temperature sensor:	1 optional	payment terms:	L/C,Western Union,D/P,D/A,T/T,MoneyGram,PayPal
weight:	35kg	type:	digital
brand:	Dinghua Technology	current:	other
Board size:	Min: 20mm20mm, Max: 400mm375mm	Supply capacity:	500 sets per month
Placement Accuracy:	±0.01MM	Packaging Preview:
Temperature Accuracy:	±2°C	model:	DH-A1L-C
Heater power:	Top heater hot air 1200W, second heater 3000W, IR preheat 1200W	Voltage:	220V/50HZ
Rated Capacity:	5400W	aspect:	560x530x590mm
Temperature control accuracy:	±2℃	BGA chip:	2x2-80x80mm
port:	Shenzhen	Packaging Details:	Standard plywood box packing size: 847057cm Gross weight: 61kg
Type of prompt:	other	temperature control:	K sensor closed-loop control, independent heating
place of origin; place of origin:	Guangdong, China	Warranty:	2 years

Dinghua Manufacturer

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Dinghua cost-effective multi-function chip replacement machine bga rework station DH-A1L-C

There is a simple video for your reference:

https://youtu.be/jQDVymQJkjs

DH-A1L-C Details and Warranty:

Warranty period: one year for other parts of the machine

DH-A1L-C Specifications:

total power	54000W
top heater	12000W
bottom heater	The second 1200W
IR preheat zone	The third infrared heater 3000W
power supply	AC220V±10% 50Hz
head	Two heads: hot air and infrared, easy to replace.
Maximum hot air speed	It can be adjusted by the adjustment knob to prevent tiny bga movement when heating.
cleaning tin	With digital soldering iron, the residual tin after desoldering can be quickly removed to prevent oxidation of pcb and bga
top heater movement	Right/Left, Front/Back, Free Rotation.
light	Dual shadowless LED lights, freely adjustable at any angle
operating mode	Digital display panel meter
storage	A large number of temperature curve sets.
position	Intelligent positioning, "5-point support" + V-groove PCB bracket + universal clamp can realize PCB adjustment in X and Y directions.
temperature control	K sensor, closed loop
temperature accuracy	±2℃
Board size	Maximum 400×370 mm Minimum 22×22 mm
BGA chip	2x2 - 80x80 mm
Minimum chip pitch	0.15mm
External temperature sensor	1 item
aspect	L570×W610×H570mm
net weight	35KG