MachineryOffers

New and Hot quantum boards mixed with Samsung LM301B and Cree XPE 660nm 730nm

Product details
Min. Line Width:0.2mm;Min. Hole Size:0.3mm;
Number of layer:1layer;Testing:Function testing;
PCB type:LED PCB;Base Material:Aluminum;
Delivery:DHL FedEx UPS;Model Number:Customized;
Board Thickness:0.4-2.0mm;Port:Shenzhen;
Payment Terms:T/T,Western Union,Paypal;Packaging Detail:Inner vacuum packing,Outer carton box;
Warranty:3years;PCB clone:Acceptable;
Diodes:LM301B CREE XPE;Brand Name:HS;
Surface Finishing:HASL ENIG OSP;Copper Thickness:1-3oz;
Supply Ability:10000 Square Meter/Square Meters per Month;Dsign service:Available;
Other service:Components purchasing and assembly;Place of Origin:Guangdong China (Mainland);
Certificate:CE UL ROHS;Min. Line Spacing:0.2mm;

New and Hot quantum boards mixed with Samsung LM301B and Cree XPE 660nm 730nm

 

 

 

 

 

 

 

 

FAQ: 

Q:1.Can i have a sample to test?

  A:Yes,we can send you samples to test.

 

Q:2.What specifications do you need for PCB quotation?

  A:We need your PCB Gerber file,board thickness,copper thickness,surface finishing and quantity to quote you.

 

Q:3.What is the lead time?

  A:Samples need 3-5days,mass production needs 7-10days,also according to the order volume.

 

Q:4.Do you have MOQ limit?

  A:Even 1 pcs,we care.

 

Q:5.Can you offer the best price for us?

  A:Yes,we are specialized PCB manufacturer directly,we can offer lower price than any trading company.

 

Q:6.How do you ship the goods and how long does it take arrival?

  A:We usually ship by DHL,UPS,FedEx and TNT.It takes 3-5days to arrive.

 

Q:7.What are the payment terms?

  A:You can pay us with Paypal,Western Union and T/T Bank.

 

Q:8.Can we visit your factory?

  A:Yes,welcome to visit our factory anytime,and we will lead you to visit our  factory and our production line.

 

Manufacturing Capability: 

item

Manufacture Capability

Material

FR4,CEM-1, Aluminium, Polyamide

Layer No.

1-12

Finished board thickness

0.1 mm-4.0mm

Board Thickness Tolerance

±10%

Cooper thickness

0.5 OZ-3OZ (18 um-385 um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp&Twist

0.70%

Peelable

0.012"(0.3mm)-0.02’(0.5mm)

Images

Min Trace Width (a)

0.075mm (3mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

SMD Pitch (a)

0.2 mm(8 mil)

BGA Pitch (b)

0.2 mm (8 mil)

Solder Mask

Min Solder Mask Dam (a)

0.0635 mm (2.5mil)

Solder mask Clearance (b)

0.1mm (4 mil)

Min SMT Pad spacing (c)

0.1mm (4 mil)

Solder Mask Thickness

0.0007"(0.018mm)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (35 mil)

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  3-7um  Au:1-5u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.125mm, Punching: ±0.15mm

Beveling

30°45°

Gold Finger angle

15° 30° 45° 60°

Certificate 

ROHS,  ISO9001:2008,  SGS,  UL certificate

 

 

 

 

 

 

 

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