| Certificates: | UL ROHS ISO9001 ISO14001; | Maximun size: | 500mm*800mm; |
| Base Material: | FR4; | Type: | Panel manufacture; |
| Insulation Layer Thickness: | 0.075mm-5.0mm; | Brand Name: | XJY; |
| Port: | Shenzhen; | Copper Thickness: | 1oz; |
| Aspect Ratio: | 13:1; | Solder Mask: | Green, blue, red, white, black, etc; |
| Surface Finishing: | LF-HASL; | Board Thickness: | 1.6mm; |
| Layer counts: | 2-16; | Payment Terms: | L/C,D/A,D/P,T/T,Western Union,MoneyGram,paypal; |
| Place of Origin: | Guangdong China; | Min. Line Spacing: | 5 Mil; |
| Min. Hole Size: | 0.15mm; | Supply Ability: | 10000 Piece/Pieces per Month; |
| Packing: | Vacuum or carton; | Test: | AOI; |
| Packaging Detail: | Packaging Detail:Pcb inner packing:vacuum plastic packing Pcb outer packing :standard caron packing; | Model Number: | JY PCB; |
| Plus Via Diameter: | 0.25mm-0.60mm; | Min. Line Width: | 0.075(3mil); |
Skype:+8615107111605
Shenzhen XinJiaYe Electronics Technology Co,.Itd.
| Item | Capability | Item | Capability |
| Layers | 1-28 | Thicker Copper | 1-6oz |
| Products Type | HF(High-Frequency)&(Radio Frequency) board, Imedance controlled board,HDI board, BGA& Fine pitch board | solder mask | Nanya&Taiyo, LPI&Matt red, green,yellow,white,blue,black. |
| Base Material | FR4(Shengyi China, ITEQ, KB A+,HZ),HI-TG,Fr06,Rogers,Taconic,Argon,Naclo,Isola and so on | Finished Surface | Conventional HASL, Lead-Free HASL,Flash Gold,ENIG(Immersion Gold),OSP(Entek),Immersion Tin, Immersion Sliver, Hard Gold |
| Selective Surface Treatment | EING(Immersion Gold)+OSP, ENIG(Immersion Gold)+Gold Finger, Flash Gold Finger, Immersion Sliver+Gold Finger, Immersion Tin+Gold Finger | ||
| Technical Specification | Minimum line width/gap | 3.5/4mil(laser dirll) | |
| Minimum hole size | 0.15mm(mechanical dirll) 4mil(laser dirll) | ||
| Minimum Annular Ring | 4mil | ||
| Max Copper Thickness | 6oz | ||
| Max Production Size | 600mm*800mm | ||
| Board Thickness | D/S:0.2-7.0mm, Multilayer:0.4-7.0mm | ||
| Min Solder Mask Bridge | ≥0.08mm | ||
| Aspect Ratio | 15:1 | ||
| Plugging Vias Capability | 0.2-0.8mm | ||
| Tolerance | Plated holes Tolerance | ±0.08mm(min±0.05) | |
| Non-Plated Hole Tolerance | ±0.05mm(min+0/-0.05mm or +0.05/-0mm) | ||
| Outline Tolerance | ±0.15mil(min±0.10mm) | ||
| Functional Test | |||
| Insulating Resistance | 50ohms(normality) | ||
| Peel Off Strength | 1.4N/mm | ||
| Thermal Stress Test | 265℃,20seconds | ||
| Solder Mask Hardness | 6H | ||
| E-test Voltage | 500V+15/-0V 30s | ||
| Warp and Twist | |||
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PCB manufacture Technical Requirement
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