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LED/LCD/OLED 4K TV Screen Single Press Head Single Screen Pulse Heating ACF COF TAB Bonding Machine

Product details
Brand Name:Olian;Control System:Panasonic PLC Control system;
Package Type:Wooden carton;After-sales Service Provided:No overseas service provided;
Dimension(L*W*H):W1200*1200*H1380MM;Name:Single Press Head Pulse Heating ACF/COF/TAB/OLB/PCB Bonding Machine;
Warranty:1 Year;Weight:550kg;
Heating System:Pulse Heating System;Single package size:192X168X178 cm;
Certification:no;Place of Origin:Guangdong China;
Condition:New;Power(W):2200W;
Suitable for:Suitable for FPC/COF bonding;Voltage:AC220V/50Hz;
Selling Units:Single item;Power:2200W;
Size Range:12~85 inch;Single gross weight:600 KG;

LED/LCD/OLED 4K TV Screen Single Press Head Single Screen Pulse Heating ACF COF TAB Bonding Machine

Product Description

Features:

 

• Pulse Heat ACF TAB FPC COF OLB PCB Bonding Machine for LCD LED TV Screen Repair

• Design for 12” – 85” LCD/LED TV PANEL repair.

• Bonding ACF and FPC/COF/FOG/TAB/OLB/PCB to LCD and PCB (TFT, IPS).

• Control by PLC, pulse heating method.

• Touch screen operation, multiple bonding parameters can be set.

• FPC/COF/FOG/TAB/OLB/PCB hot bar process.

• Platform can move at X, Y and Z direction flexibly.

• CCD system helps to place work piece.

 

 

Specifications:

ACF/COF/OLB/PCB BONDING MACHINE SPECIFICATIONS

Equipment Model Number

OL-1285SH(Single Head)

Device Description

Repair screen machine / Bonding machine

Device Uses

FPC, COF,TAB ,OLB, LCD Panel and PCB combination bonding

Applicable LCD panel specifications

12"-85"

Applicable LCD panel thickness

0.3MM-1.1MM[Single glass]

Bonding IC number

Multiple / Panel

Bind direction

X or Y Uni-direction

  

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Supply Pressure

0.5~0.7Mpa (Dry air source)

Power Supply

AC 220V±10%,50HZ,2200W

Cylinder Device

SMC original thin cylinder

Pressure System

Pressure system parallel bars structure can eliminates Indenter own weight, the pressure minimum accuracy to 0.1 KG , pressure part both are use SMC precision components

Heating Type

Pulse (rapid heating / cooling and auxiliary cooling function)

PID Temperature Control System

Branded:Adjustable heating curve Precision PID self-tuning type
The peak temperature : within +/- 2 degrees Celsius Room temperature time to 180 degrees the response time within 2-3 seconds

Hot pressing head

Materials:  Titanium
origin: United States 45*1.4*10
Plane precision (hot press side) :0.001mm
Plane thickness 0.5 (Reserved 3 times grinding)

Thermocouple Type

K type  OMEGA wire

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Model:OL-1285SH-SS
Product Name:FOF single station Pulse Heating Bonding machine
Suitable For:Suitable for OLB/PCB/FPC/COF Contraposition bonded to LCD which attached ACF,Used for COF repair
Size Range:12-85inch
Bonding Precision:X±0.01MM ,Y±0.01MM
Machine Capacity:12S/Pcs,2500pcs/day
Indenter Qty:1PCS
Power Supply:220V±10%,50HZ,2200W
Air Supply:0.4~0.7MPa,dry air
FPC size:Max:L80*W60MM Min:L10*W15MM
Platform Precision:±0.01MM
Pressure Head Size:80*1MM (customizable)
Temp Range:RT~400℃
Time Range:1~99.9sec
Product Size:W1200*1200*H1380MM
N.W:About 450kg
Packing Size: 
G.W:About 550kg 6CBM

Pictures:

 

 

Glossary:

 

What is ACF?

1, The common explanation:

ACF is anisotropic conductive film, a kind of  material  in the bonding process to be used in capacitive screen, resistive screen, touch screen, LCD screen, tablet PC, mobile phone screens, etc.Means a resin film containing a heat-conductive particles of a thermoplastic or cured. Mainly for LCD panel signal transmission link with the driver IC, the need to bonding different interface to choose suitable conductive particles and density, generally used for fine pitch of the conductive particles having a diameter of about 3 ~ 5 um.

2, Professional explanation:

 The English abbreviation of ACF is Anisotropic Conductive Film, ACF is the electrical conduction in the Z-axis direction and the XY insulation resistance characteristic plane has obvious differences. When the difference between Z-axis and the XY plane on-resistance value of the insulation resistance exceeds a predetermined ratio, also can be called well anisotropic conductivity.

 

 

What is the COF

1, The popular explanation:

COF package is to put the IC dependend on FPC: COF package for flip chip film.

2, Professional explanation:

COF is the abbreviation of Chip - on - flex, is to put the IC dependend on FPC,a new technology developed of liquid crystal display module,  by it in terms of product size, weight, high integration, have very big breakthrough.Due to the flexible circuit board PCB thickness thin, lighter than the solid, so COF package module is small volume, light weight, and the design and production speed  is quickly.

 

What is the pulse hot-pressing machine?
1, The popular explanation:

Pulsed hot pressing machine is by hot pressing head loading pulse voltage, hot head heating , will be connected to the object, when the temperature rises to solder melting point after (i.e., after the rise to the predetermined temperature), will be connected to the tin melting between the objects and put it together.Applied to mobile phone manufacturer, touch screen manufacturers, such as computer, printer manufacturers, production technology applied in the following products: USB wire welding, soft wire FFC flexible PCB FPC or rigid circuit board PCB welding, TCP and circuit board PCB or PCB FPC welding between soft,welding?flexible circuit board FPC between circuit board PCB , etc.

2, Professional explanation:

Pulse hot press is the English translation of Pulse hot press, by hot pressing head loading Pulse voltage, ?hot head heating , will be connected to this object to heat up, when the temperature rises to soldering tin melting point (i.e., to simulate the temperature after), will be connected to the tin melting between the objects and connect it together. The general Pulse hot-press temperature closed loop control.

 

Keywords:

About LCD ACF COF TAB FLEX CABLE VACUUM HEAT PRESS THERMAL REPAIR BONDING MACHINE keywards

According to the COF/FOG/FOB bonding  machine and in order to promotion and application,they have many kinds of key names : for example, the upper and lower pulse bonding machines, the pulse bonding machines, semi-automatic bonding machines, automatic bonding machines, single-position bonding machine, pulse up and down hot pressing machine,the pulse hot pressing machine, semi-automatic hot pressing machine, automatic hot pressing machines, single-position hot pressing machine, up down pulse hot pressing bonding machines,up pulse hot pressing bonding machine, semi-automatic hot pressing bonding machine, automatic hot pressing bonding machines, single-position hot pressing bonding machines, single-position pulse bonding machines, single-position pulse pressing machine, FOG up down pulse bonding machines, FOG the pulse bonding machines, FOG semi-automatic bonding machine, FOG automatic bonding machines, single-position FOG bonding machines, FOG up down pulse hot pressing machine,, OGS up and down pulse bonding machines,OGS up pulse bonding machines, OGS semi-automatic bonding machine, OGS automatic bonding machines, single -position OGS bonding machines, OGS up down pulse hot pressing machine,  OGS up pulse pressing machine, OGS semi-automatic hot pressing machine, OGS automatic hot pressing machine,OGS single-position hot pressing machine   , OGS up down pulse hot pressing bonding machines, OGS up pulse hot pressing bonding machines, OGS semi-automatic hot pressing bonding machine, OGS automatic hot pressing bonding machines, OGS single-position hot pressing bonding machines, OGS single-position pulse bonding machines, OGS single -position pulse hot pressing machine,FOB up and down pulse bonding machines, FOB up pulse bonding machines , FOB semi-automatic bonding machines, FOB automatic bonding machines, single-position FOB bonding machines, FOB up and down pulse hot pressing machine,  FOB up pulse hot pressing machine , FOB Semi-automatic hot pressing machine, FOB automatic hot pressing machine, single-position FOB hot pressing machine , FOB up and down pulse hot pressing bonding machines,FOB up hot pulse hot pressing  bonding machines, FOB semi-automatic hot pressing bonding machine, FOB automatic hot pressure bonding machines, single-position  FOB hot pressing bonding machines, single-position  FOB pulse hot pressing  bonding machines, single-position  FOB pulse hot pressing machine, FOB / TAB bonding machines, FOB / TAB bonding equipment,FOG up and down pulse bonding equipment  ,  FOG up pulse bonding equipment, FOG semi-automatic bonding equipment, FOG automatic bonding equipment, single-position FOG bonding equipment, FOG up down pulse hot pressing equipment, FOG up pulse hot pressing equipment , FOG Semi-automatic hot pressing equipment, FOG automatic hot pressing equipment,  FOG single-position hot pressing equipment, FOG up down pulse hot pressing  bonding equipment,FOG up pulse hot pressing  bonding equipment FOG semi-automatic hot pressing bonding equipment, FOG automatic hot pressure bonding equipment, move around the platform hot pressing machine, the platform and move around hot pressing bonding machine,move around the platform bonding equipment , move around the platform hot  pressing equipment.

 

Packaging & Shipping

 

Our Services

 

Company Information

About us 

Shenzhen Olian Automatic Equipment Co., Ltd (Olian) is a high-tech enterprise established in 2008, specialized in R&D, manufacturing and sales of LCD module automatic equipment.

Olian insist on the product concept of " High quality, High efficiency", have successfully developed standard and custom products:

Main products

1. LCD module machine:

Large, medium and small size COG machine, Semi-automatic COG machine, Automatic COG machine, ACF attach machine, COG press bonding machine, TAB, FOG hot press bonding machine, SMT machine, Tear film machine, detection device, PLASMA, LCD clearing machine;

Auxiliary equipment: IC disassembling machine, ACF split machine, Molybdenum wire machine, Heating platform, Manual or pneumatic test stand, etc; 

2. Capacitive screen Touch screen device:

G + F laminating machine, G + G vacuum laminating machine, Touch screen ACF attach machine, Touch screen FOG, Hot press machine, PETOCA laminating machine, F + F, Automatic laminating machine, TP protective film laminating machine;

3.Large size LCD Equipment:13-55 inch ACF attach machine, COF press machine, PCB press machine, COF Pre-press machine, OLB Bonding machine;

4. Non-standard program design and development; 

5. Accessories and maintenance of the LCD module and TP equipment: Quartz, Test stand, All kinds of indenter( SU440C indenter, Tungsten steel indenter, Titanium alloy indenter) production and maintenance, grinding or design.

Olian welcome customers to visit our company for technical exchange and business negotiation. Olian will do the best to provide you with high quality equipment and satisfactory service. Olian determined to become the leading brands of the industry.

Olian Welcome agents and reseller around the world,

Welcome OEM&ODM for you.

 

 

 

FAQ

 

 

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